칩과 리드프레임 사이의 계면파괴인성치에 대한 실험적 고찰 = An experimental study on interfacial toughness between chip and leadframe

Advisors
엄윤용researcherEarmme, Youn-Youngresearcher
Publisher
한국과학기술원
Issue Date
1999
Identifier
150443/325007 / 000973495
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 기계공학과, 1999.2, [ 40 p. ]

Keywords

온도; 계면파괴인성치; 팝콘 현상; 패키지; 위상각; Phase angle; Temperature; Interfacial toughness; Pop-corning; Package

URI
http://hdl.handle.net/10203/45088
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=150443&flag=t
Appears in Collection
ME-Theses_Master(석사논문)
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