칩과 리드프레임 사이의 계면파괴인성치 측정A measurement of the interfacial fracture toughness between chip and lead frame

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Advisors
엄윤용researcherEarmme, Youn-Youngresearcher
Description
한국과학기술원 : 기계공학과,
Publisher
한국과학기술원
Issue Date
1998
Identifier
133443/325007 / 000963674
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 기계공학과, 1998.2, [ vii, 59 p. ]

Keywords

리드프레임; 칩; 계면파괴인성치; 에폭시 접착제; Epoxy adhesive; Lead frame; Chip; The interfacial fracture toughness

URI
http://hdl.handle.net/10203/44990
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=133443&flag=dissertation
Appears in Collection
ME-Theses_Master(석사논문)
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