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Results 1-10 of 197 (Search time: 0.003 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) Altmetrics
1
Conference
Unit Cell Modeling of Interconnect Isolated by Metal-filled Via Array for High Crosstalk Immunity

Kim, Jounghoresearcher; Lee, Heeseok; Park, Bongcheol; Kam, Dong Gun, IEEE 6th Workshop on Signal Propagation on Interconnects, pp.41 - 43, IEEE, 2002

2
Conference
Measurement of Picosecond Pulse Propagation Characteristics on Coplanar Transmission Lines

Kim, Jounghoresearcher; Lee, Jongjoo; Yu, S., 5th IEEE Workshop on Signal Propagation on Interconnects, IEEE, 2001

3
Conference
Microwave Frequency Dielectric Constant and Loss Tangent Measurements of PCB materials Using Stripline Structure

Kim, Jounghoresearcher; Kim, Jingook; Lee, Junho; Kim, Namhoon; Lee, Junwoo, APACK2001, 2001

4
Conference
Picosecond Pulse Propagation Measurement on CPW Using A Photoconductive Near-Field Probe

Kim, Jounghoresearcher; Lee, Jongjoo, 2th MINT Milimeter-wave International, pp.109 - 112, 2001

5
Conference
Radiated emission from Plasma Display Panel (PDP) depending on addressing line structure and current driving scheme

Jeong, Y.; Lee, J.; Kim, J.; Choi, S.; Kim, Jounghoresearcher; Park, H.H.; Kang, K.; Kim, H.; Whang, K., 2002 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.140 - 143, IEEE, 2002-08-19

6
Conference
Picosecond-pulse propagation measurement on microstrip meander lines using a novel optical near-field mapping probe

Lee, J.; Kim, Jounghoresearcher, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.117 - 120, IEEE, 2001-10-29

7
Conference
Microwave frequency crosstalk model of redistribution line patterns of wafer level package

Sung, M.; Kim, N.; Lee, J.; Choi, B.; Park, I.; Hong, J.-K.; Kwon, Y.; Choi, K.S.; Kim, Jounghoresearcher, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.109 - 112, IEEE, 2001-10-29

8
Conference
Effect of ground guard fence with via and ground slot on radiated emission in multi-layer digital printed circuit board

Lee, H.; Kim, J.; Ahn, S.; Byun, J.-G.; Kang, D.-S.; Choi, C.-S.; Hwang, H.-J.; Kim, Jounghoresearcher, 2001 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.653 - 656, IEEE, 2001-08-13

9
Conference
3 GHz Wide Frequency Model of Ferrite Bead for Power/Ground Noise Simulation of High-speed PCB

Kim, Jounghoresearcher; Kim, Tae Hong; Lee, Junho; Kim, Hyungsoo, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.217 - 220, IEEE, 2002

10
Conference
Design Comparison of I/O Port Ground and Power Plane for Enhanced ESD Immunity

Kim, Jounghoresearcher; Lee, Junho; Kim, Tae Hong; Kim, Hyungsoo; Ryu, Woonghwan; Choi, Jae Chun, EMC Europe 2002 International Symposium on Electromagnetic Compatibility, 2002

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