전자 패키지에서 다층 구조의 기계적인 신뢰성에 관한 연구A study on mechanical reliability of multi- layered structure in electronic packages
- Description
- 한국과학기술원 : 기계공학전공,
- Publisher
- 한국과학기술원
- Issue Date
- 2002
- Identifier
- 177247/325007 / 000965096
- Language
- kor
- Description
학위논문(박사) - 한국과학기술원 : 기계공학전공, 2002.8, [ x, 107 p. ]
- Keywords
계면파괴역학; 신뢰성; 다층 구조; 전자 패키지; 열응력; thermal stress; interfacial fracture mechanics; reliability; multi-layered structure; electronic packages
- Appears in Collection
- ME-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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