반도체 패키지 내에 존재하는 균열의 거동에 관한 연구A study on behavior of crack in a plastic package
- Description
- 한국과학기술원 : 기계공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 1996
- Identifier
- 105467/325007 / 000885386
- Language
- kor
- Description
학위논문(박사) - 한국과학기술원 : 기계공학과, 1996.2, [ x, 80 p. ]
- Keywords
압력하중; 열하중; 패키지균열; 균열진전방향; Crack propagation direction; Pressure loading; Thermal loading; Package crack
- Appears in Collection
- ME-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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