학위논문(석사) - 한국과학기술원 : 전기및전자공학전공, 2009.2, [ ix, 67, 9 p. ]
SiP; Mixed-Signal; 3D; Noise; T-DMB; 시스템-인-패키지; 혼성신호; 3D; 잡음; T-DMB; SiP; Mixed-Signal; 3D; Noise; T-DMB; 시스템-인-패키지; 혼성신호; 3D; 잡음; T-DMB
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