Effect of power supply noise coupling in CMOS active balun for UHF RFID applications

Abstract

In these days, radio frequency identificaiton (RFID) reader become be incorporated in mobile products to identify information from a RFID tag. Mobile RFID reader is needed to become smaller size and lower power consumption. To satify this condition, System-in-Package (SiP) technology has been applied to RFID reader system. However, there are many problems as SiP has been applied. In a mobile RFID reader, there are digital circuits, RF circuits, analog circuits together in a pacakge. There is power noise coupling from digital circuit to RF circuit because digital circuit and RF circuit exist on same package. This package coupling noise is a main path to degrade the performance of the RFID system. Another noise coupling path is silicon substrate as digital circuit and RF circuit share same silicon substrate. In this paper, we analyze the effect of power coupling noise from two paths on RF circuit by using measurement and modeling and simulation. And then, we propose noise reduction methods. We compare package coupling noise with silicon substarte coupling noise.