플립 칩 본딩으로 패키징한 레이저 다이오우드 어레이에서의 열적 특성 변화 분석Analysis of thermal characteristic variation in LD arrays packaged by flip-chip solder bump bonding technique
- Advisors
- 신상영researcher; Shin, Sang-Yungresearcher
- Description
- 한국과학기술원 : 전기및전자공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 1995
- Identifier
- 99262/325007 / 000933242
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 전기및전자공학과, 1995.2, [ [ii], 59 p. ]
- Appears in Collection
- EE-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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