Modeling and design of BGA type package for low inductance power/ground impedance and simultaneous switching noise

Abstract

Nowadays, all the current electrical packaging trends require high speed over Gb/s, high current and high I/O pin count. To achieve the requirement, the distribution of the package must provide a low impedance connection between the power and ground to the devices. In this study, the effect of via and ball distribution and power/ground ring on multi-layer power and ground network of ball grid array type package is analyzed and measured. For the investigation of the effect of via and ball distribution, several kinds of patterns were manufactured. The number of vias and balls, power/ground ratio and distribution of via, and with or without power/ground rings are the varied factors of the patterns. The effective impedance and simultaneous switching noise is extracted from the simulation and the impedance is compared with s-parameter measurement result. From the result of the study, the optimal design of power/ground of BGA type package is suggested.