Microwave frequency modeling of next generation high-density packages = 차세대 고밀도 패키지의 마이크로 웨이브 주파수 영역에서의 모델링에 관한 연구

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dc.contributor.advisorKim, Jung-Ho-
dc.contributor.advisor김정호-
dc.contributor.authorAhn, Seung-Young-
dc.contributor.author안승영-
dc.date.accessioned2011-12-14T01:45:53Z-
dc.date.available2011-12-14T01:45:53Z-
dc.date.issued2000-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=157454&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/37295-
dc.description학위논문(석사) - 한국과학기술원 : 전기및전자공학전공, 2000.2, [ ix, 64 p. ]-
dc.description.abstractIn this paper, new model parameter extraction procedure for high-density packages is proposed. The s-parameters were measured up to 20 GHz using network analyzer HP8510 and cascade probe, and the cascade transmission matrix conversion was performed to extract the equivalent circuit model parameters of the high-density packages. We applied the proposed procedure to extract the model parameters of Anisotropic Conductive Film (ACF) flip-chip package and Multiple Line Grid Array (MLGA) package. As a result of the model parameter extraction, we have shown that the high-density packages have possibilities of the application in the frequency range of over 10 GHz. We also analyzed the extracted parameters of the packages with the considerations of the characteristics of material and physical structure and suggested the future direction of the high-density packages. Finally, we confirmed the reliability of the proposed method and discussed about the problems and further works for more reliable measurement and model parameter extraction.eng
dc.languageeng-
dc.publisher한국과학기술원-
dc.titleMicrowave frequency modeling of next generation high-density packages = 차세대 고밀도 패키지의 마이크로 웨이브 주파수 영역에서의 모델링에 관한 연구-
dc.typeThesis(Master)-
dc.identifier.CNRN157454/325007-
dc.description.department한국과학기술원 : 전기및전자공학전공, -
dc.identifier.uid000983317-
dc.contributor.localauthorKim, Jung-Ho-
dc.contributor.localauthor김정호-
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EE-Theses_Master(석사논문)
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