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학위논문(석사) - 한국과학기술원 : 전기및전자공학과, 1997.2, [ ii, 56 p. ]
하이브리드 적외선 감지 소자; 인듐 범프; 플립 칩 본딩; Flip-chip bonding; Hybrid infrared focal plane array; Indium bump
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