Low Cost wafer-level packaging method based on anodized aluminum substrate with backside signal Pad and EMC passivation = 양극산화 알루미늄 기판 기반의 신호 패드 및 에폭시 몰딩 컴파운드의 보호막을 포함한 웨이퍼 레벨 패키지

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This thesis studies the package methodology in Wafer-Level Package (WLP) and Multi-Chip Module-Deposition (MCM-D) for RF applications. The study is focused in anodized aluminum substrate, suitable for manufacture cost reduction. The advantages of this package type are that it does not require additional wire bonding or solder bumping techniques. The fabricated chip is mounted on circuit board by conductive epoxy, similar to surface mount device. Also the passivation of epoxy molding compound (EMC) provide additional protection to the chip. A fabrication process was developed which is quite straight forward, compared to Si or 3-5 group compound substrates. All the fabrication process was conducted in semiconductor process, guaranteeing high integration density. The fabrication process is described in detail in chapter 3, including the circuit fabrication process and package process. Also, an effective equivalent circuit model was established in lumped elements for future designs. EM geometrical simulations were performed for confirmation. The previous modeling method is explained in chapter 4. The circuit model was verified by experimental measurements in chapter 5 and a balun also acting as a band pass filter was fabricated base on the proposed package method and the results were discussed in chapter 6.
Advisors
Kwon, Young-Seresearcher권영세researcher
Description
한국과학기술원 : 전기 및 전자공학과,
Publisher
한국과학기술원
Issue Date
2010
Identifier
419104/325007  / 020083110
Language
eng
Description

학위논문(석사) - 한국과학기술원 : 전기 및 전자공학과, 2010.2, [ 64 p. ]

Keywords

알루미늄; 양극산화; 패키지; 레벨; 웨이퍼; aluminum; anodized; package; wafer-level

URI
http://hdl.handle.net/10203/36569
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=419104&flag=dissertation
Appears in Collection
EE-Theses_Master(석사논문)
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