Wideband equivalent circuit model for a through silicon via with effective substrate current loop

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An equivalent circuit model of through silicon via considering the eddy current flow inside the silicon is proposed to predict the electrical performance up to 100GHz. The parasitic elements of the proposed circuit model are derived by the structural dimensions and material properties of the TSV, and its electrical performance of the proposed equivalent circuit model is analyzed with structure size variations. The analyzed results show the proposed model accurately expresses the physical meaning.
Publisher
Institute of Electrical and Electronics Engineers Inc.
Issue Date
2015-12
Language
English
Citation

IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.12 - 14

DOI
10.1109/EDAPS.2015.7383663
URI
http://hdl.handle.net/10203/313068
Appears in Collection
GT-Conference Papers(학술회의논문)
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