Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jang, SY | ko |
| dc.contributor.author | Wolf, J | ko |
| dc.contributor.author | Ehrmann, O | ko |
| dc.contributor.author | Gloor, H | ko |
| dc.contributor.author | Reichl, H | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2008-01-18T02:13:56Z | - |
| dc.date.available | 2008-01-18T02:13:56Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001-05-29 | - |
| dc.identifier.citation | 51st Electronic Components and Technology Conference, pp.950 - 956 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/2843 | - |
| dc.description.sponsorship | The authors wish to thank the team of Dept. HDI&WLP at IZM especially Dr. Engelmann for his helpful advise and Heinz Gloor (Unaxis) for his kind help to provide different UBM layers. | en |
| dc.language | English | - |
| dc.language.iso | en_US | en |
| dc.publisher | Electronic Components and Technology Conference | - |
| dc.title | Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000169430500157 | - |
| dc.identifier.scopusid | 2-s2.0-0034836666 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 950 | - |
| dc.citation.endingpage | 956 | - |
| dc.citation.publicationname | 51st Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Orlando, FL | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Jang, SY | - |
| dc.contributor.nonIdAuthor | Wolf, J | - |
| dc.contributor.nonIdAuthor | Ehrmann, O | - |
| dc.contributor.nonIdAuthor | Gloor, H | - |
| dc.contributor.nonIdAuthor | Reichl, H | - |
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