Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder

Issue Date
2001-05-29
Language
ENG
Citation

51st Electronic Components and Technology Conference, pp.950 - 956

ISSN
0569-5503
URI
http://hdl.handle.net/10203/2843
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
Investigation of UBM Systems for Electroplated Sn37Pb and Sn3.5Ag Solder(아카이빙).pdf(1.77 MB)Download
  • Hit : 591
  • Download : 329
  • Cited 0 times in thomson ci

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0