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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder

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Jang, SY / Wolf, J / Ehrmann, O / Gloor, H / Reichl, H / Paik, Kyung-Wookresearcher
Publisher
Electronic Components and Technology Conference
Issue Date
2001-05-29
Language
English
Citation

51st Electronic Components and Technology Conference, pp.950 - 956

ISSN
0569-5503
URI
http://hdl.handle.net/10203/2843
Appears in Collection
MS-Conference Papers(학술회의논문)
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