DC Field | Value | Language |
---|---|---|
dc.contributor.author | Oh, SH | ko |
dc.contributor.author | Lee, KC | ko |
dc.contributor.author | Chun, J | ko |
dc.contributor.author | Kim, M | ko |
dc.contributor.author | Lee, Seung Seob | ko |
dc.date.accessioned | 2008-01-14T12:01:32Z | - |
dc.date.available | 2008-01-14T12:01:32Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2001-05 | - |
dc.identifier.citation | JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.11, no.3, pp.221 - 225 | - |
dc.identifier.issn | 0960-1317 | - |
dc.identifier.uri | http://hdl.handle.net/10203/2754 | - |
dc.description.abstract | A micro heat flux sensor which can measure the thermal energy transfer per unit area has been designed, fabricated, and calibrated in a convective environment. The sensor which is based on a circular foil gage is composed of thermal paths and a thermopile. The thermal path is made in a LIGA-like process of SU-8 high aspect ratio microstructures and electroplated copper layers. The thermopile, a series of thermocouples, is used to amplify the output signal as a thermometer. When the sensor is placed on a high-temperature wall, heat flux from the wall flows through thermal paths and drains out to the environment, producing a temperature difference along its paths. Heat flux is obtained by calibrating this temperature difference in the thermopile of Ni-Cr or Al-Chromel pairs. The sensitivity of the heat flux sensor of Ni-Cr and Al-Chromel pairs is in the range of 0.1-2.0 and 0.4-2.0 muV mW(-1) cm(-2), respectively, in the heat flux range of 0-180 mW cm(-2). | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IOP PUBLISHING LTD | - |
dc.title | Micro heat flux sensor using copper electroplating in SU-8 microstructures | - |
dc.type | Article | - |
dc.identifier.wosid | 000168904300010 | - |
dc.identifier.scopusid | 2-s2.0-0343773239 | - |
dc.type.rims | ART | - |
dc.citation.volume | 11 | - |
dc.citation.issue | 3 | - |
dc.citation.beginningpage | 221 | - |
dc.citation.endingpage | 225 | - |
dc.citation.publicationname | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.identifier.doi | 10.1088/0960-1317/11/3/310 | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Lee, Seung Seob | - |
dc.contributor.nonIdAuthor | Oh, SH | - |
dc.contributor.nonIdAuthor | Lee, KC | - |
dc.contributor.nonIdAuthor | Chun, J | - |
dc.contributor.nonIdAuthor | Kim, M | - |
dc.type.journalArticle | Article | - |
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