The finite element analysis of internal stresses during sequential build-up of lamination-based thick-film multilayer substrates

The thermomechanical behavior of multilayer structures is a subject of perennial interest. Among various multilayer structures, we provided a thorough investigation on the lamination-based thick-film multilayer substrates, or the multichip module substrates. Firstly, we offered an in-depth look at the composite bean analysis (CBA) recently suggested for thick-film multilayer structures. The calculated substrate bow values using the CBA model were compared with the measured values and calculated values from numerical analysis. The magnitude and distribution of biaxial, shear, and peel stresses in thick-film multilayer substrates during sequential build-up of thick-film polymer dielectrics were calculated and discussed. Secondly, for users' convenience, the most widely-used analytical methods for microelectronics applications were summarized along with the CBA model, and their possible applications were suggested.
Publisher
KLUWER ACADEMIC PUBL
Issue Date
2000-02
Language
ENG
Keywords

POLYIMIDE FILMS; THERMAL-EXPANSION; MECHANICAL-STRESS; TEMPERATURE; FORMULA; HISTORY

Citation

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.11, no.1, pp.45 - 56

ISSN
0957-4522
DOI
10.1023/A:1008956204189
URI
http://hdl.handle.net/10203/2721
Appears in Collection
MS-Journal Papers(저널논문)
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