Modeling and measurement of through glass via-channels, noise coupling and suppressions in glass interposer for digital system package

Abstract

In 2.5D/3D integration technologies, glass interposers are superior alternative solution for silicon interposers due to low insertion loss and cost. However, glass interposers are vulnerable to noise coupling issues including RDL noise and TGV noise due to low loss property of glass substrates. When the TGV coupling noise is generated in the glass interposer, the low loss of the glass substrate cannot suppress the generated noise which cause signal integrity issues. Therefore, analysis of TGV noise coupling is essential in glass interposer. Currently, it is hard to analyze TGV noise couplings and TGV noise coupling suppressions due to absence of TGV models. In this paper, equivalent circuit models of TGV and RDL for TGV noise coupling path analysis in glass interposer were proposed. The proposed TGV and RDL models were verified by measurement and simulation results. Using the proposed models of TGV and RDL, four TGV noise coupling suppression methods were proposed and verified by measurement or simulation results.