DC Field | Value | Language |
---|---|---|
dc.contributor.author | Shin, Seung Wook | ko |
dc.contributor.author | Kim, Jong-Seon | ko |
dc.contributor.author | Kim, Seon Joon | ko |
dc.contributor.author | Kim, Dae Woo | ko |
dc.contributor.author | Jung, Hee-Tae | ko |
dc.date.accessioned | 2019-05-29T01:25:03Z | - |
dc.date.available | 2019-05-29T01:25:03Z | - |
dc.date.created | 2019-05-28 | - |
dc.date.created | 2019-05-28 | - |
dc.date.issued | 2019-07 | - |
dc.identifier.citation | JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, v.75, pp.296 - 303 | - |
dc.identifier.issn | 1226-086X | - |
dc.identifier.uri | http://hdl.handle.net/10203/262235 | - |
dc.description.abstract | We demonstrate that graphene can enhance the etch resistance of polymeric hardmask significantly. Graphene oxide with a sub-micrometer diameter (nGO) was functionalized with fluorinated poly (hydroxyamide) (FPHA) via a chemical coupling reaction. The FPHA-functionalized-nGO can be dispersed in various organic solvents including methanol, cyclohexanone, dimethylformamide, and N-methyl pyrrolidone. In addition, the dispersions were spincoated to prepare hardmask films which were then thermally annealed to produce nRGO-fluorinated-polybenzoxazole (FPBO) film. Compared to pristine FPBO film, elastic modulus (122%), hardness (92%), and etch resistance (54%) were significantly enhanced at 17 wt.% graphene loading, surpassing the properties of commercial CHM009 film. (C) 2019 The Korean Society of Industrial and Engineering Chemistry. Published by Elsevier B.V. All rights reserved. | - |
dc.language | English | - |
dc.publisher | ELSEVIER SCIENCE INC | - |
dc.title | Polybenzoxazole/graphene nanocomposite for etching hardmask | - |
dc.type | Article | - |
dc.identifier.wosid | 000466248600034 | - |
dc.identifier.scopusid | 2-s2.0-85063686080 | - |
dc.type.rims | ART | - |
dc.citation.volume | 75 | - |
dc.citation.beginningpage | 296 | - |
dc.citation.endingpage | 303 | - |
dc.citation.publicationname | JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY | - |
dc.identifier.doi | 10.1016/j.jiec.2019.03.042 | - |
dc.identifier.kciid | ART002492959 | - |
dc.contributor.localauthor | Jung, Hee-Tae | - |
dc.contributor.nonIdAuthor | Shin, Seung Wook | - |
dc.contributor.nonIdAuthor | Kim, Seon Joon | - |
dc.contributor.nonIdAuthor | Kim, Dae Woo | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Hardmask | - |
dc.subject.keywordAuthor | Composite | - |
dc.subject.keywordAuthor | Grapheme oxide | - |
dc.subject.keywordAuthor | Patterning | - |
dc.subject.keywordAuthor | Etch resistance | - |
dc.subject.keywordPlus | GRAPHENE OXIDE | - |
dc.subject.keywordPlus | CARBON NANOTUBES | - |
dc.subject.keywordPlus | MEMBRANES | - |
dc.subject.keywordPlus | RESISTANCE | - |
dc.subject.keywordPlus | BEHAVIOR | - |
dc.subject.keywordPlus | WATER | - |
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