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Optimized Inverter Design of Ring Oscillator based Wafer-Level TSV Connectivity Test (RO-TSV-CT)

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Kim, Jounghoresearcher / Joohee Kim / Daniel H. Jung / Junho Lee / Kunwoo Park
Publisher
EDAPS2012
Issue Date
2012-12-10
Language
English
Citation

2012 IEEE Electrical Design of Advanced Package & Systems Symposium

URI
http://hdl.handle.net/10203/259162
Appears in Collection
EE-Conference Papers(학술회의논문)
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