3D-TSV Vertical Interconnection Using Cu/SnAg Double Bumps and Non-Conductive Films (NCFs)
- Issue Date
- 2013-01-23
- Language
- English
- Citation
2013 Pan Pacific Microelectronics Symposium
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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