Printed circuit board and manufacturing method there of인쇄 회로 기판 및 그 제조 방법
- Assignee
- KAIST, SAMSUNG ELECTRO MECH
- Country
- JA (Japan)
- Issue Date
- 2017-12-01
- Application Date
- 2014-07-17
- Application Number
- 2014-146679
- Registration Date
- 2017-12-01
- Registration Number
- 6250489
- Appears in Collection
- CBE-Patent(특허)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.