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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

3D TSV Vertical Interconnection Using NCF Materials

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dc.contributor.authorPaik, Kyung-Wookko
dc.contributor.authorChoi,Yong-Woonko
dc.contributor.authorShin , Ji-Wonko
dc.date.accessioned2019-04-15T15:56:33Z-
dc.date.available2019-04-15T15:56:33Z-
dc.date.created2014-12-10-
dc.date.issued2014-02-11-
dc.identifier.citation2014 Pan Pacific Microelectronics Symposium-
dc.identifier.urihttp://hdl.handle.net/10203/255469-
dc.languageEnglish-
dc.publisher2014 Pan Pacific Microelectronics Symposium-
dc.title3D TSV Vertical Interconnection Using NCF Materials-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname2014 Pan Pacific Microelectronics Symposium-
dc.identifier.conferencecountryUS-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorChoi,Yong-Woon-
dc.contributor.nonIdAuthorShin , Ji-Won-
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MS-Conference Papers(학술회의논문)
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