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Results 1-5 of 5 (Search time: 0.005 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Small-Size Low-Cost Wideband Continuous-Time Linear Passive Equalizer With an Embedded Cavity Structure on a High-Speed Digital Channel

Shin, Min-Chul; Kim, Myunghoi; Kim, Ji-Seong; Kim, Jounghoresearcher; Ahn, Seungyoungresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.1, pp.94 - 99, 2014-01

2
RF interconnect for multi-Gbit/s board-level clock distribution

Ryu, Woonghwan; Lee, Junwoo; Kim, Hyungsoo; Ahn, Seungyoungresearcher; Kim, Namhoon; Choi, Baekkyu; Kam, Donggun; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.398 - 407, 2000-08

3
Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems

Cho, Yeonje; Kim, Jonghoon; Kim, DongHyun; Lee, Seongsoo; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; Kim, Hyoungjun; Seo, Chulhun; Ahn, Seungyoungresearcher; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.353 - 364, 2016-02

4
EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger using Tightly-coupled Three-phase Resonant Magnetic Field

Song, Chiuk; Kim, Hongseok; Kim, Youngwoo; Kim, Dong-Hyun; Jeong, Seung Taek; Cho, Yeonje; Lee, Seongsoo; Ahn, Seungyoungresearcher; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.65, no.9, pp.6839 - 6849, 2018-09

5
High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling

Kim, Sukjin; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Ahn, Seungyoungresearcher; Kim, Jonghoon; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878, 2015-07

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