Results 1-4 of 4 (Search time: 0.001 seconds).
|NO||Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)|
|1||Microwave frequency model of FPBGA solder ball extracted from S-parameters measurement|
|2||High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm|
Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoungresearcher; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wookresearcher; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09
|3||Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer|
|4||RF interconnect for multi-Gbit/s board-level clock distribution|
Ryu, Woonghwan; Lee, Junwoo; Kim, Hyungsoo; Ahn, Seungyoungresearcher; Kim, Namhoon; Choi, Baekkyu; Kam, Donggun; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.398 - 407, 2000-08