Search

Start a new search
Current filters:
Add filters:
  • Results/Page
  • Sort items by
  • In order
  • Authors/record

Results 1-4 of 4 (Search time: 0.002 seconds).

1

Microwave frequency model of FPBGA solder ball extracted from S-parameters measurement

Lee, Jungho; Ahn, Seungyoungresearcher; Kwon, Woon-Seong; Paik, Kyung-Wookresearcher; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E87C, pp.1621 - 1627, 2004-09

2

High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoungresearcher; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wookresearcher; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09

3

Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

Ahn, Seungyoungresearcher; Lee, Junho; Kim, Jounghoresearcher; Ryu, Woonghwan; Kum, Byung-Hun; Choi, HS; Yoon, CK, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.26, pp.90 - 98, 2003-02

4

RF interconnect for multi-Gbit/s board-level clock distribution

Ryu, Woonghwan; Lee, Junwoo; Kim, Hyungsoo; Ahn, Seungyoungresearcher; Kim, Namhoon; Choi, Baekkyu; Kam, Donggun; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.398 - 407, 2000-08

rss_1.0 rss_2.0 atom_1.0