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Results 1-10 of 15 (Search time: 0.003 seconds).

1

Electromagnetic Compatibility of Resonance Coupling Wireless Power Transfer in On-Line Electric Vehicle System

Chun, Yangbae; Park, Seongwook; Kim, Jong Hoon; Kim, Ji Seong; Kim, Hongseok; Kim, Jounghoresearcher; Kim, Nam; Ahn, Seungyoungresearcher, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E97B, no.2, pp.416 - 423, 2014-02

2

Small-Size Low-Cost Wideband Continuous-Time Linear Passive Equalizer With an Embedded Cavity Structure on a High-Speed Digital Channel

Shin, Min-Chul; Kim, Myunghoi; Kim, Ji-Seong; Kim, Jounghoresearcher; Ahn, Seungyoungresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.1, pp.94 - 99, 2014-01

3

Low Leakage Electromagnetic Field level and High Efficiency using A Novel Hybrid Loop-array Design for Wireless High Power Transfer System

Lee, Seongsoo; Kim, Dong-Hyun; Cho, Yeonje; Kim, Hongseok; Song, Chiuk; Jeong, Seungtaek; Song, Jinwook; Park, Gyeyoung; Hong, Seokwoo; Park, Junyong; Cho, Kyungjun; Lee, Hyunsuk; Seo, Chulhun; Ahn, Seungyoungresearcher; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.66, no.6, pp.4356 - 4367, 2019-06

4

Microwave frequency model of FPBGA solder ball extracted from S-parameters measurement

Lee, Jungho; Ahn, Seungyoungresearcher; Kwon, Woon-Seong; Paik, Kyung-Wookresearcher; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E87C, pp.1621 - 1627, 2004-09

5

High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoungresearcher; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wookresearcher; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09

6

Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoungresearcher; Kim, Jounghoresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12

7

Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

Ahn, Seungyoungresearcher; Lee, Junho; Kim, Jounghoresearcher; Ryu, Woonghwan; Kum, Byung-Hun; Choi, HS; Yoon, CK, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.26, pp.90 - 98, 2003-02

8

RF interconnect for multi-Gbit/s board-level clock distribution

Ryu, Woonghwan; Lee, Junwoo; Kim, Hyungsoo; Ahn, Seungyoungresearcher; Kim, Namhoon; Choi, Baekkyu; Kam, Donggun; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.398 - 407, 2000-08

9

Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems

Cho, Yeonje; Kim, Jonghoon; Kim, DongHyun; Lee, Seongsoo; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; Kim, Hyoungjun; Seo, Chulhun; Ahn, Seungyoungresearcher; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.353 - 364, 2016-02

10

Coil Design and Measurements of Automotive Magnetic Resonant Wireless Charging System for High-Efficiency and Low Magnetic Field Leakage

Kim, Hongseok; Song, Chiuk; Jung, Daniel Hyunsuk; Kim, DongHyun; Kim, In Myoung; Kim, Young Il; Kim, Jong Hoon; Ahn, Seungyoungresearcher; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.383 - 400, 2016-02

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