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Results 11-20 of 54 (Search time: 0.002 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
11
Rigorous mathematical model of through-silicon via capacitance

Kim, Kibeom; Kim, Jedok; Kim, Hongkyun; Ahn, Seungyoungresearcher, IET CIRCUITS DEVICES & SYSTEMS, v.12, no.5, pp.589 - 593, 2018-09

12
Elliptic Function Compact-size of the Band-pass Filter Using Complimentary MNZ metamaterial Resonator

Yoon, Ki Cheol; Ahn, Seungyoungresearcher; Lee, Jong-Chul, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.60, no.12, pp.2907 - 2912, 2018-12

13
Miniaturization of Implantable Micro-Robot Propulsion Using a Wireless Power Transfer System

Kim, Dongwook; Hwang, Karam; Park, Jaehyoung; Park, Hyun Ho; Ahn, Seungyoungresearcher, MICROMACHINES, v.8, no.9, 2017-09

14
2017 Asia-Pacific International Symposium on EMC (APEMC), Seoul, Korea

Ahn, Seungyoungresearcher, IEEE ELECTROMAGNETIC COMPATIBILITY MAGAZINE, v.6, no.3, pp.98 - 103, 2017-11

15
Autonomous Coil Alignment System Using Fuzzy Steering Control for Electric Vehicles with Dynamic Wireless Charging

Hwang, Karam; Park, Jaehyoung; Kim, Dongwook; Park, Hyun Ho; Kwon, Jong Hwa; Kwak, Sang Il; Ahn, Seungyoungresearcher, MATHEMATICAL PROBLEMS IN ENGINEERING, 2015

16
Pickup Coil Counter for Detecting the Presence of Trains Operated by Wireless Power Transfer

Hwang, Karam; Kim, Dongwook; Har, Dongsooresearcher; Ahn, Seungyoungresearcher, IEEE SENSORS JOURNAL, v.17, no.22, pp.7526 - 7532, 2017-11

17
Microwave frequency model of FPBGA solder ball extracted from S-parameters measurement

Lee, Jungho; Ahn, Seungyoungresearcher; Kwon, Woon-Seong; Paik, Kyung-Wookresearcher; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E87C, pp.1621 - 1627, 2004-09

18
High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoungresearcher; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wookresearcher; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09

19
Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoungresearcher; Kim, Jounghoresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12

20
Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

Ahn, Seungyoungresearcher; Lee, Junho; Kim, Jounghoresearcher; Ryu, Woonghwan; Kum, Byung-Hun; Choi, HS; Yoon, CK, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.26, pp.90 - 98, 2003-02

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