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Showing results 1 to 2 of 2

1
PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

Pak, Jun-So; Kim, Joo-Hee; Cho, Jong-Hyun; Kim, Ki-Yeong; Song, Tai-Gon; Ahn, Seung-Young; Lee, Jun-Ho; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.208 - 219, 2011-02

2
Reverse osmosis desalination process optimized for maximum permeate production with renewable energy

Lee, Sangkeum; Myung, Sunghee; Hong, Junhee; Har, Dongsoo, DESALINATION, v.398, pp.133 - 143, 2016-11

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