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Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory

Kim, HyunWoong; Park, Jongcheol; Lee, Sanguk; Kim, Jongwook; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.12, pp.1973 - 1988, 2023-12

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