GT-Journal Papers(저널논문)

Recent Items

Collection's Items (Sorted by Submit Date in Descending order): 321 to 328 of 328

321
설계공간 조정과 세분화를 이용한 너클의 위상 최적설계

장인권researcher; 유용균; 곽병만researcher, 대한기계학회논문집 A, v.30, no.5, pp.595 - 601, 2006-05

322
Design space optimization using design space adjustment and refinement

Jang, In Gwunresearcher; Kwak, Byung Manresearcher, STRUCTURAL AND MULTIDISCIPLINARY OPTIMIZATION, v.35, pp.41 - 54, 2008-01

323
Computational study of Wolffs law with trabecular architecture in the human proximal femur using topology optimization

Jang, In Gwunresearcher; Kim, Il Yong, JOURNAL OF BIOMECHANICS, v.41, no.11, pp.2353 - 2361, 2008

324
Microwave frequency model of FPBGA solder ball extracted from S-parameters measurement

Lee, Jungho; Ahn, Seungyoungresearcher; Kwon, Woon-Seong; Paik, Kyung-Wookresearcher; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E87C, pp.1621 - 1627, 2004-09

325
High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoungresearcher; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wookresearcher; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09

326
RF interconnect for multi-Gbit/s board-level clock distribution

Ryu, Woonghwan; Lee, Junwoo; Kim, Hyungsoo; Ahn, Seungyoungresearcher; Kim, Namhoon; Choi, Baekkyu; Kam, Donggun; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.398 - 407, 2000-08

327
Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoungresearcher; Kim, Jounghoresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12

328
Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

Ahn, Seungyoungresearcher; Lee, Junho; Kim, Jounghoresearcher; Ryu, Woonghwan; Kum, Byung-Hun; Choi, HS; Yoon, CK, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.26, pp.90 - 98, 2003-02

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