GT-Journal Papers(저널논문)

Recent Items

Collection's Items (Sorted by Submit Date in Descending order): 301 to 317 of 317

301
A-GNSS Sensitivity for Parallel Acquisition in Asynchronous Cellular Networks

Kong, Seung-Hyunresearcher; Nam, Wooseok, IEEE TRANSACTIONS ON WIRELESS COMMUNICATIONS, v.9, no.12, pp.3770 - 3778, 2010-12

302
Statistical Analysis of Urban GPS Multipaths and Pseudo-Range Measurement Errors

Kong, Seung-Hyunresearcher, IEEE TRANSACTIONS ON AEROSPACE AND ELECTRONIC SYSTEMS, v.47, no.2, pp.1101 - 1113, 2011-04

303
PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

Pak, Jun-So; Kim, Joo-Hee; Cho, Jong-Hyun; Kim, Ki-Yeong; Song, Tai-Gon; Ahn, Seung-Youngresearcher; Lee, Jun-Ho; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.208 - 219, 2011-02

304
Pattern design of a non-pneumatic tyre for stiffness using topology optimization

Jang, In Gwunresearcher; Sung, Young Hwa; Yoo, Eui Jong; Kwak, Byung Manresearcher, ENGINEERING OPTIMIZATION, v.44, no.2, pp.119 - 131, 2012-02

305
Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects

Cho, Jeonghyeon; Song, Eak-Hwan; Kim, Hee-Gon; Ahn, Seung-Youngresearcher; Pak, Jun-So; Kim, Ji-Seong; Kim, Joung-Horesearcher, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.53, no.3, pp.814 - 822, 2011-08

306
풍동실험에 의한 갠트리 크레인의 풍력계수 산출과 구조 해석

이재환; 김태완; 장인권researcher; 한순흥researcher, 대한조선학회 논문집, v.48, no.2, pp.165 - 170, 2011-04

307
Asynchronous layered interface of multimedia SoCs for multiple outstanding transactions

Jung, Eun-Gu; Har, Dongsooresearcher; Lee, Jeong-Gun; Jhang, Kyoung-Son; Lee, Jeong-A, JOURNAL OF VLSI SIGNAL PROCESSING SYSTEMS FOR SIGNAL IMAGE AND VIDEO TECHNOLOGY, v.46, no.2-3, pp.133 - 151, 2007-03

308
설계공간 최적화를 이용한 뼈 성장 모사

장인권researcher; 곽병만researcher, 대한기계학회논문집 A, v.30, no.6, pp.722 - 727, 2006-06

309
Evolutionary topology optimization using design space adjustment based on fixed grid

Jang, In Gwunresearcher; Kwak, Byung Manresearcher, INTERNATIONAL JOURNAL FOR NUMERICAL METHODS IN ENGINEERING, v.66, pp.1817 - 1840, 2006-06

310
설계공간 조정과 세분화를 이용한 너클의 위상 최적설계

장인권researcher; 유용균; 곽병만researcher, 대한기계학회논문집 A, v.30, no.5, pp.595 - 601, 2006-05

311
Design space optimization using design space adjustment and refinement

Jang, In Gwunresearcher; Kwak, Byung Manresearcher, STRUCTURAL AND MULTIDISCIPLINARY OPTIMIZATION, v.35, pp.41 - 54, 2008-01

312
Computational study of Wolffs law with trabecular architecture in the human proximal femur using topology optimization

Jang, In Gwunresearcher; Kim, Il Yong, JOURNAL OF BIOMECHANICS, v.41, no.11, pp.2353 - 2361, 2008

313
Microwave frequency model of FPBGA solder ball extracted from S-parameters measurement

Lee, Jungho; Ahn, Seungyoungresearcher; Kwon, Woon-Seong; Paik, Kyung-Wookresearcher; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E87C, pp.1621 - 1627, 2004-09

314
High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoungresearcher; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wookresearcher; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09

315
RF interconnect for multi-Gbit/s board-level clock distribution

Ryu, Woonghwan; Lee, Junwoo; Kim, Hyungsoo; Ahn, Seungyoungresearcher; Kim, Namhoon; Choi, Baekkyu; Kam, Donggun; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.398 - 407, 2000-08

316
Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoungresearcher; Kim, Jounghoresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12

317
Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

Ahn, Seungyoungresearcher; Lee, Junho; Kim, Jounghoresearcher; Ryu, Woonghwan; Kum, Byung-Hun; Choi, HS; Yoon, CK, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.26, pp.90 - 98, 2003-02

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