In-Pixel Aperture CMOS Image Sensor for 2-D and 3-D Imaging

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This paper presents a CMOS image sensor with the in-pixel aperture technique for single-chip 2-D and 3-D imaging. In conventional image sensors, the aperture is located at the camera lens. However, in the proposed image sensor, the aperture is integrated on the CMOS image sensor chip and is formed at a metal layer of the CMOS image sensor (CIS) process. A pixel array of the image sensor is composed of the W, R, B, and PA pixels (W pixel with integrated metal aperture) for extracting color and depth information. While the image of the W pixel becomes blurred with increasing distance from a focused object, the image of the PA pixel maintains the sharpness. Therefore, the depth image can be obtained using the depth from the defocus method. The size of the pixel, which is based on a four-transistor active pixel sensor with pinned photodiode, is 2.8 mu m x 2.8 mu m. A prototype of the proposed image sensor was fabricated using the 0.11-mu m CIS process and its performance was evaluated.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2018-11
Language
English
Article Type
Article
Citation

IEEE SENSORS JOURNAL, v.18, no.22, pp.9163 - 9168

ISSN
1530-437X
DOI
10.1109/JSEN.2018.2869383
URI
http://hdl.handle.net/10203/246884
Appears in Collection
EE-Journal Papers(저널논문)
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