Electrothermal Analysis With Nonconvective Boundary Conditions

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Electrothermal analogy allows heat conduction and heat convection to be modeled as a simple resistive or RC network. A practical environment in which a chip is located is often not purely convective. Nonetheless, the environment is typically approximated as convective for simplicity of analysis. This yields inaccuracy of temperature estimation; ad hoc calibration process is necessary to match estimation and measurement by empirically adjusting thermal parameters. In this brief: 1) we extract electrothermal analogy through mathematical derivation and 2) this allows us to understand how the basic resistive network can be modified to handle non-convective environment accurately. The new network is applied in the estimation of steady-state and transient temperature as well as in thermal design power. A smartphone under the sunlight is assumed as an example of non-convective environment. Estimation of steady-state temperature using our network is compared to actual measurement, which demonstrates its accuracy.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2018-08
Language
English
Article Type
Article
Keywords

SIMULATION; DESIGN

Citation

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, v.65, no.8, pp.1044 - 1048

ISSN
1549-7747
DOI
10.1109/TCSII.2018.2805186
URI
http://hdl.handle.net/10203/245185
Appears in Collection
EE-Journal Papers(저널논문)
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