DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | Im, Sung Gap | - |
dc.contributor.advisor | 임성갑 | - |
dc.contributor.author | Kim, Bong Jun | - |
dc.contributor.author | 김봉준 | - |
dc.date.accessioned | 2018-05-23T19:35:31Z | - |
dc.date.available | 2018-05-23T19:35:31Z | - |
dc.date.issued | 2017 | - |
dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=718954&flag=dissertation | en_US |
dc.identifier.uri | http://hdl.handle.net/10203/241898 | - |
dc.description | 학위논문(박사) - 한국과학기술원 : 생명화학공학과, 2017.8,[x, 146 p. :] | - |
dc.description.abstract | With the increasing demand for future electronic devices, organic electronics such as organic light-emitting diodes is emerging owing to its unique advantages such as flexibility, thinness, and light weight. However, organic electronics degrade rapidly upon exposure to water vapor and oxygen in ambient condition. In this thesis, thin film encapsulation that protects the organic electronics from penetration of water vapor and oxygen are investigated. Initiated chemical vapor deposition was adopted along with atomic layer deposition process to fabricate the thin film encapsulation composed of organic/inorganic multilayer. The thin film encapsulation was applied to various organic electronics to confirm the increase in stability and elongation of device life time. | - |
dc.language | eng | - |
dc.publisher | 한국과학기술원 | - |
dc.subject | initiated chemical vapor deposition (iCVD)▼aatomic layer deposition (ALD)▼athin film encapsulation (TFE)▼abarrier film▼awater vapor transmission rate (WVTR) | - |
dc.subject | 개시제를 이용한 화학 기상 증착 공정▼a원자층 증착 공정▼a박막 봉지▼a봉지막▼a수분투과율 | - |
dc.title | Fabrication of thin film encapsulation for organic electronic devices via initiated chemical vapor deposition (iCVD) | - |
dc.title.alternative | 개시제를 이용한 화학 기상 증착 공정을 활용한 유기전자소자용 박막 봉지 기술 개발 | - |
dc.type | Thesis(Ph.D) | - |
dc.identifier.CNRN | 325007 | - |
dc.description.department | 한국과학기술원 :생명화학공학과, | - |
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