Fabrication of thin film encapsulation for organic electronic devices via initiated chemical vapor deposition (iCVD) = 개시제를 이용한 화학 기상 증착 공정을 활용한 유기전자소자용 박막 봉지 기술 개발

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With the increasing demand for future electronic devices, organic electronics such as organic light-emitting diodes is emerging owing to its unique advantages such as flexibility, thinness, and light weight. However, organic electronics degrade rapidly upon exposure to water vapor and oxygen in ambient condition. In this thesis, thin film encapsulation that protects the organic electronics from penetration of water vapor and oxygen are investigated. Initiated chemical vapor deposition was adopted along with atomic layer deposition process to fabricate the thin film encapsulation composed of organic/inorganic multilayer. The thin film encapsulation was applied to various organic electronics to confirm the increase in stability and elongation of device life time.
Advisors
Im, Sung Gapresearcher임성갑researcher
Description
한국과학기술원 :생명화학공학과,
Publisher
한국과학기술원
Issue Date
2017
Identifier
325007
Language
eng
Description

학위논문(박사) - 한국과학기술원 : 생명화학공학과, 2017.8,[x, 146 p. :]

Keywords

initiated chemical vapor deposition (iCVD)▼aatomic layer deposition (ALD)▼athin film encapsulation (TFE)▼abarrier film▼awater vapor transmission rate (WVTR); 개시제를 이용한 화학 기상 증착 공정▼a원자층 증착 공정▼a박막 봉지▼a봉지막▼a수분투과율

URI
http://hdl.handle.net/10203/241898
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=718954&flag=dissertation
Appears in Collection
CBE-Theses_Ph.D.(박사논문)
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