Foreword: Special Section on Recent Progress in the Electrical Design of Advanced Package and Systems (Part 2)
Under the continuing motivation to follow up the recent progress in the electrical modeling and design, this Special Section includes articles that are the significantly extended versions of papers presented in the Electrical Design of Advanced Packaging and Systems Symposium held in Honolulu, HI, USA, from December 14 to 16, 2016. The seven articles in this Special Section made contributions mainly in the design research, indicating the increasing number of applications that require package-based system design considerations.
- Issue Date
- 2018-04
- Language
- English
- Article Type
- Editorial Material
- Citation
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.4, pp.509 - 510
- ISSN
- 2156-3950
- Appears in Collection
- GT-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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