Foreword: Special Section on Recent Progress in the Electrical Design of Advanced Package and Systems (Part 2)

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 41
  • Download : 0
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2018-04
Language
English
Article Type
Editorial Material
Citation

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.4, pp.509 - 510

ISSN
2156-3950
DOI
10.1109/TCPMT.2018.2820397
URI
http://hdl.handle.net/10203/241583
Appears in Collection
GT-Journal Papers(저널논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0