DC Field | Value | Language |
---|---|---|
dc.contributor.author | Zhang, Shuye | ko |
dc.contributor.author | Yang, Ming | ko |
dc.contributor.author | Wu, Yang | ko |
dc.contributor.author | Du, Jikun | ko |
dc.contributor.author | Lin, Tiesong | ko |
dc.contributor.author | He, Peng | ko |
dc.contributor.author | Huang, Mingliang | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2018-04-24T06:35:19Z | - |
dc.date.available | 2018-04-24T06:35:19Z | - |
dc.date.created | 2018-04-18 | - |
dc.date.created | 2018-04-18 | - |
dc.date.issued | 2018-03 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.3, pp.383 - 391 | - |
dc.identifier.issn | 2156-3950 | - |
dc.identifier.uri | http://hdl.handle.net/10203/241451 | - |
dc.description.abstract | Although cationic epoxy was optimized for low-melting SnBi58 solder ACF joints with the lowest coefficient of thermal expansion (CTE) in terms of reliability, cationic epoxy also showed a faster curing property than any other types of adhesives. In fact, solder joint shapes at 250 degrees C bonding are very different from those shapes at 200 degrees C bonding. In this paper, four adhesive film types were investigated in terms of Sn-3Ag-0.5Cu solder ACF joint shapes on the electrical performances and reliability in a pressure cooker test (PCT). Thermal stability of adhesive films was tested to be first. Resin curing speeds were measured in a 250 degrees C isothermal mode differential scanning calorimetry, resin viscosities were checked by a parallel-plate rheometer, and adhesive thermomechanical properties, such as modulus and CTE, were characterized. Then, four different types of ACF resins containing the same weight percentages of Sn-3Ag-0.5Cu solders were assembled by the same thermocompression bonding parameter (250 degrees C 10s 2MPa on bump) on a 500-mu m-pitch flex-on-board (FOB) application, and different solder joint morphologies were verified. Various bonded solder ACFs joints were compared in terms of solder wetting areas, electrical performances by a four-point-probe method, and the reliability of PCT (121 degrees C 100% humidity 2atm) for 120 h. This paper aims at optimizing the best adhesive film candidate for SAC305 solder ACF joints of FOB application. | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.subject | PACKAGING TECHNOLOGY | - |
dc.subject | SOLDER ACFS | - |
dc.subject | ADHESIVES | - |
dc.subject | JOINTS | - |
dc.title | A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature | - |
dc.type | Article | - |
dc.identifier.wosid | 000428689800008 | - |
dc.identifier.scopusid | 2-s2.0-85041429624 | - |
dc.type.rims | ART | - |
dc.citation.volume | 8 | - |
dc.citation.issue | 3 | - |
dc.citation.beginningpage | 383 | - |
dc.citation.endingpage | 391 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | - |
dc.identifier.doi | 10.1109/TCPMT.2018.2790979 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Zhang, Shuye | - |
dc.contributor.nonIdAuthor | Yang, Ming | - |
dc.contributor.nonIdAuthor | Wu, Yang | - |
dc.contributor.nonIdAuthor | Du, Jikun | - |
dc.contributor.nonIdAuthor | Lin, Tiesong | - |
dc.contributor.nonIdAuthor | He, Peng | - |
dc.contributor.nonIdAuthor | Huang, Mingliang | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Anisotropic conductive film | - |
dc.subject.keywordAuthor | high reliability | - |
dc.subject.keywordAuthor | Sn-3Ag-0.5Cu solder | - |
dc.subject.keywordAuthor | thermal compression bonding | - |
dc.subject.keywordPlus | PACKAGING TECHNOLOGY | - |
dc.subject.keywordPlus | SOLDER ACFS | - |
dc.subject.keywordPlus | ADHESIVES | - |
dc.subject.keywordPlus | JOINTS | - |
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