Nanotwinned metal MEMS films with unprecedented strength and stability

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Silicon-based microelectromechanical systems (MEMS) sensors have become ubiquitous in consumer-based products, but realization of an interconnected network of MEMS devices that allows components to be remotely monitored and controlled, a concept often described as the "Internet of Things," will require a suite of MEMS materials and properties that are not currently available. We report on the synthesis of metallic nickel-molybdenum-tungsten films with direct current sputter deposition, which results in fully dense crystallographically textured films that are filled with nanotwins. These films exhibit linear elastic mechanical behavior and tensile strengths exceeding 3 GPa, which is unprecedented for materials that are compatible with wafer-level device fabrication processes. The ultrahigh strength is attributed to a combination of solid solution strengthening and the presence of dense nanotwins. These films also have excellent thermal and mechanical stability, high density, and electrical properties that are attractive for next-generation metal MEMS applications.
Publisher
AMER ASSOC ADVANCEMENT SCIENCE
Issue Date
2017-06
Language
English
Article Type
Editorial Material
Keywords

STRAIN-RATE SENSITIVITY; THIN-FILMS; DEFORMATION MECHANISMS; ULTRAHIGH STRENGTH; MICROELECTROMECHANICAL SYSTEMS; NANOCRYSTALLINE NICKEL; ACTIVATION VOLUME; NANOSCALE; NI; TWINS

Citation

SCIENCE ADVANCES, v.3, no.6

ISSN
2375-2548
DOI
10.1126/sciadv.1700685
URI
http://hdl.handle.net/10203/240174
Appears in Collection
ME-Journal Papers(저널논문)
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