DC Field | Value | Language |
---|---|---|
dc.contributor.author | Han, Ki Jin | ko |
dc.contributor.author | Ahn, Seungyoung | ko |
dc.date.accessioned | 2018-02-21T05:53:28Z | - |
dc.date.available | 2018-02-21T05:53:28Z | - |
dc.date.created | 2018-02-05 | - |
dc.date.created | 2018-02-05 | - |
dc.date.created | 2018-02-05 | - |
dc.date.issued | 2018-01 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.1, pp.3 - 4 | - |
dc.identifier.issn | 2156-3950 | - |
dc.identifier.uri | http://hdl.handle.net/10203/240152 | - |
dc.description.abstract | With the emergence of new technical trends such as Internet of Things, Big Data, wearable electronics, automotive electronics, and 3-D printing, the role of electrical design of packages and package-based systems is more important than ever. In addition to ongoing challenges to achieve higher integration density along with maintaining electrical integrity, multiphysics and low-power design requirements should be addressed. In order to provide solutions for upcoming applications and design challenges, novel ideas on design as well as advanced modeling approaches are continuously demanded. | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.title | Foreword: Special Section on Recent Progress in the Electrical Design of Advanced Package and Systems | - |
dc.type | Article | - |
dc.identifier.wosid | 000422951400001 | - |
dc.identifier.scopusid | 2-s2.0-85040811353 | - |
dc.type.rims | ART | - |
dc.citation.volume | 8 | - |
dc.citation.issue | 1 | - |
dc.citation.beginningpage | 3 | - |
dc.citation.endingpage | 4 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | - |
dc.identifier.doi | 10.1109/TCPMT.2017.2787938 | - |
dc.contributor.localauthor | Ahn, Seungyoung | - |
dc.contributor.nonIdAuthor | Han, Ki Jin | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Editorial Material | - |
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