Pressure drop and heat transfer characteristics of wavy plate fins for the low-reynolds number flow

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Publisher
The American Society of Mechanical Engineers
Issue Date
2017-08
Language
English
Citation

InterPACK 2017-International Technical Conference and Exhibition on Packaging and Intergration of Electronic and Photonic Microsystems

URI
http://hdl.handle.net/10203/239195
Appears in Collection
ME-Conference Papers(학술회의논문)
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