MATERIAL PATTERN, AND MOLD, METAL THIN-FILM PATTERN, METAL PATTERN USING THEREOF, AND METHODS OF FORMING THE SAME

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The present invention relates to a material pattern, and mold using thereof, metal thin-film pattern, metal pattern, and method of forming the sames. A method of forming the material pattern according to the present invention comprises the steps of; (a) forming a photo-sensitive material film by coating a photo-sensitive material on a substrate; (b) deciding an exposure section on the photo-sensitive material film; (c) disposing a light refraction film and a light diffusion film at a route of light exposed on the photo-sensitive material film; and (d) forming a pattern on the photo-sensitive material film, by projecting a light on the exposure section of the photo-sensitive material film, wherein the light transmits the light refraction film and the light diffusion film. A method of forming the material pattern according to the present invention can form the material pattern of three-dimensional asymmetric structure having various inclinations and shapes and can form simply mold, metal thin-film and metal pattern using thereof.
Assignee
KAIST
Country
US (United States)
Issue Date
2012-10-02
Application Date
2008-04-04
Application Number
12098180
Registration Date
2012-10-02
Registration Number
8,278,028
URI
http://hdl.handle.net/10203/235918
Appears in Collection
EE-Patent(특허)
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