System-in-package having reduced influence between conductor and antenna and method of designing the same컨덕터의 안테나에 대한 영향이 감소된 SiP 및 그 설계 방법
The present invention relates to a SiP having reduced influence between a conductor and an antenna, and a method of designing the SiP. The SiP includes an antenna configured to function to transmit or receive data and mounted in the SiP to be integrated in the SiP, and a first planar conductor having at least one slit formed therein. Therefore, the present invention minimizes the amount of current or electromagnetic field induced on the conductor by the current or electromagnetic field of the antenna, thus reducing the influence of the conductor on the operating characteristics of the antenna.
- Assignee
- KAIST
- Country
- US (United States)
- Issue Date
- 2010-07-20
- Application Date
- 2007-12-06
- Application Number
- 11951715
- Registration Date
- 2010-07-20
- Registration Number
- 7757959
- Appears in Collection
- EE-Patent(특허)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.