DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yoon, Jun-Bo | ko |
dc.contributor.author | Yoon, Euisik | ko |
dc.contributor.author | Kim, Choong-Ki | ko |
dc.contributor.author | Han, Chul-Hi | ko |
dc.date.accessioned | 2017-12-20T10:29:51Z | - |
dc.date.available | 2017-12-20T10:29:51Z | - |
dc.date.issued | 2004-06-03 | - |
dc.identifier.uri | http://hdl.handle.net/10203/232567 | - |
dc.description.abstract | Disclosed are a three dimensional metal device floated over a semiconductor substrate, a circuit thereof, and a manufacturing method thereof. A passive electric device for wireless communications and optical communications, such as a spiral inductor, a solenoid inductor, a spiral transformer, a solenoid transformer, a micro mirror, a transmission line is floated over and apart by a few ten micrometers from the semiconductor substrate. These three dimensional metal devices remarkably decrease a signal loss to the substrate, to thereby enhance the device performance, to allow a modeling of a device separated from the substrate, and to make it possible to form an integrated circuit below the device. Further, the three dimensional metal device is manufactured in a monolithic method on the integrated circuit such that it does not affect on the integrated circuit formed therebelow. | - |
dc.title | Three- dimensional metal devices highly suspended above semiconductor substrate, their circuit model, and method for manufacturing the same | - |
dc.title.alternative | 반도체 기판 위에 높이 떠 있는 3차원 금속 소자, 그 회로모델, 및 그 제조방법 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | Yoon, Jun-Bo | - |
dc.contributor.nonIdAuthor | Yoon, Euisik | - |
dc.contributor.nonIdAuthor | Kim, Choong-Ki | - |
dc.contributor.nonIdAuthor | Han, Chul-Hi | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 10473555 | - |
dc.identifier.patentRegistrationNumber | 20040104449 | - |
dc.date.application | 2003-09-29 | - |
dc.date.registration | 2004-06-03 | - |
dc.publisher.country | US | - |
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