Signal Integrity Analysis of High-Speed Board-to-Board Floating Connectors for Automotive Systems

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Publisher
IEEE International Conference on Electrical Performance of Electronic Packaging Systems
Issue Date
2017-10-17
Language
English
Citation

IEEE International Conference on Electrical Performance of Electronic Packaging Systems

URI
http://hdl.handle.net/10203/227579
Appears in Collection
EE-Conference Papers(학술회의논문)
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