TSV 기반 3차원 소자의 열적-기계적 신뢰성 Thermo-Mechanical Reliability of TSV based 3D-IC

Publisher
한국마이크로전자및패키징학회
Issue Date
2017-03
Language
Korean
Citation

마이크로전자 및 패키징학회지, v.24, no.1, pp.35 - 43

ISSN
1226-9360
URI
http://hdl.handle.net/10203/225498
Appears in Collection
ME-Journal Papers(저널논문)
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