Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling

In this paper, we propose glass interposer electromagnetic bandgap (EBG) structure to efficiently suppress power/ground noise coupling. We designed, fabricated, measured, and analyzed a glass interposer EBG structure for the first time. Glass interposer EBG structure test vehicles were fabricated using a thin-glass substrate, low-loss polymer layers, and periodic metal patches with through glass vias (TGVs) in glass interposer power distribution network. Using the dispersion characteristics, we thoroughly analyzed and derived f(L) and f(U) of the glass interposer EBG structure. We experimentally verified that the proposed glass interposer EBG structure achieved power/ground noise suppression (below -40 dB) between f(L) of 5.8 GHz and f(U) of 9.6 GHz. Derived f(L) and f(U) based on dispersion analysis, full three-dimensional electromagnetic (3-D-EM) simulation and measurement achieved good correlation. In the glass interposer EBG structure, tapered structure of the TGV and thickness of the low-loss polymer used for metal-layers lamination affected the noise suppression bandgap significantly. The effectiveness of the proposed glass interposer EBG structure on suppression of the power/ground noise propagation and coupling to high-speed TGV channel was verified with 3-D-EM simulation. As a result, the proposed glass interposer EBG structure successfully and efficiently suppressed the power/ground noise propagation and improved eye-diagram of the high-speed TGV channel.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2017-06
Language
English
Keywords

SELECTIVE VALIDATION FSV; 3-D ICS; DESIGN; PLANES; PERFORMANCE; SYSTEMS; SIZE; CEM

Citation

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.940 - 951

ISSN
0018-9375
DOI
10.1109/TEMC.2016.2632703
URI
http://hdl.handle.net/10203/223649
Appears in Collection
EE-Journal Papers(저널논문)
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