Quantum Dot/Siloxane Composite Film Exceptionally Stable against Oxidation under Heat and Moisture

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We report on the fabrication of a siloxane-encapsulated quantum dot (QD) film (QD-silox film), which exhibits stable emission intensity for over 1 month even at elevated temperature and humidity. QD-silox films are solidified via free radical addition reaction between oligosiloxane resin and ligand molecules on QDs. We prepare the QD-oligosiloxane resin by sol gel condensation reaction of silane precursors with QDs blended in the precursor solution, forgoing ligand-exchange of QDs. The resulting QD-oligosiloxane resin remains optically clear after 40 days of storage, in contrast to other QD-containing resins which turn turbid and ultimately form sediments. QDs also disperse uniformly in the QD-silox film, whose photoluminescence (PL) quantum yield (QY) remains nearly unaltered under harsh conditions; for example, 85 degrees C/5% relative humidity (RH), 85 degrees C/85% RH, strongly acidic, and strongly basic environments for 40 days. The QD-silox film appears to remain equally emissive even after being immersed into boiling water (100 degrees C). Interestingly, the PL QY of the QD-silox film noticeably increases when the film is exposed to a moist environment, which opens a new, facile avenue to curing dimmed QD-containing films. Given its excellent stability, we envision that the QD-silox film is best suited in display applications, particularly as a PL-type down-conversion layer.
Publisher
AMER CHEMICAL SOC
Issue Date
2016-12
Language
English
Article Type
Article
Keywords

DOT-POLYMER COMPOSITES; LIGHT-EMITTING-DIODES; LIGAND-EXCHANGE; HIGHLY LUMINESCENT; IN-VIVO; NANOCRYSTALS; METHACRYLATE); CHEMISTRY; EFFICIENT; EMISSION

Citation

JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.138, no.50, pp.16478 - 16485

ISSN
0002-7863
DOI
10.1021/jacs.6b10681
URI
http://hdl.handle.net/10203/218748
Appears in Collection
CBE-Journal Papers(저널논문)MS-Journal Papers(저널논문)
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