Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory
Ultrathin silicon-based flexible 16 x 16 NAND flash memory (f-NAND) is demonstrated utilizing roll-to-plate packaging. The roll-based thermo-compression bonding of the anisotropic conductive film (ACF) transfers and simultaneously interconnects the f-NAND on a flexible printed circuit board. Reliable circuitry operation of the 16 x 16 f-NAND is confirmed with excellent flexibility and stable ACF interconnections
- Publisher
- WILEY-V C H VERLAG GMBH
- Issue Date
- 2016-10
- Language
- English
- Article Type
- Article
- Keywords
INTEGRATED-CIRCUITS; TO-ROLL; NANOIMPRINT LITHOGRAPHY; ELECTRONICS; TRANSISTORS; WAFER; TRANSPARENT; FABRICATION; FILMS
- Citation
ADVANCED MATERIALS, v.28, no.38, pp.8371 - 8378
- ISSN
- 0935-9648
- Appears in Collection
- MS-Journal Papers(저널논문)
- Files in This Item
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