Optical transceiver with in-chip temperature compensation module design and fabrication

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An optical transceiver module with in-chip temperature compensation has been implemented using a 0.13 mu m complementary metal oxide semiconductor technology to demonstrate stable light emission with temperature variations. The TRx module works up to 6.125 Gbps data rate and achieves a BER of <10(-12) with received power of -11 dBm and input power of -8.2 dBm for Tx and Rx, respectively, at room temperature (25 degrees C). A measured 3-dB bandwidth of 4.05 and 4.75 GHz are obtained for the transmitter and receiver, respectively. For a temperature increase of 25-100 degrees C, the temperature compensation effectively works for the Tx module with an increased power of 1.2 dB, whereas temperature uncompensated Rx module input power increases to 3.5 dB at 6.125 Gbps and BER of <10(-12)
Publisher
SPRINGER
Issue Date
2016-10
Language
English
Article Type
Article
Keywords

DATA CENTERS; TRANSIMPEDANCE AMPLIFIER; INTERCONNECTS; PERFORMANCE; VCSELS

Citation

OPTICAL AND QUANTUM ELECTRONICS, v.48, no.10

ISSN
0306-8919
DOI
10.1007/s11082-016-0721-9
URI
http://hdl.handle.net/10203/214112
Appears in Collection
EE-Journal Papers(저널논문)
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